polishing and dicing
SERVICE OVERVIEW
PLC Connections offers polishing and dicing services for all type of PLC components and optical circuits. Our full-service shop can handle any of your toughest edge-polishing requirements. Our dicing shop can singulate wafers up to 6 inches with a thickness range of 500µm - 5,000µm with <15µm chip-out in most materials.
services
Angle Tolerance: ± 0.3° standard, 0.1° available
Flatness tolerance 1 wave standard, ±1/4 wave on request
Scratch/dig: 20/10 standard, 10/5 on request (100% inspections in critical area)
Polish Angles: +60° to -60°
Dicing of all optical substrates and materials, up to 5mm thick
Machining of slots and custom features in silicon or quartz with depth control of ±10µm
Available blade widths from 30µm - 1,000µm
High-magnification polish quality.
Multi-channel V-groove.
END-TO-END SUPPORT
Our clients benefit from our full suite of integrated photonic services and expertise. Let us partner up with you to help move your project forward.