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trench probe fiber array

PRODUCT OVERVIEW

Trench probe fiber array units (FAUs) provide a means of testing Silicon Photonic chip die at wafer level. The arrays are used with the fibers in a near-vertical orientation with the wedge-shaped tip inserted into an etched trench in the die. The free-space beams from the fibers exit horizontally for coupling to exposed edge waveguides after mirror reflection or TIR. The tip (wedge) angle of the arrays is typically around 50° and they can be designed for trenches as small as 50µm wide by 50µm deep. They can be made using common SM or PM fiber types.

SPECIFICATIONS

  • V-Groove Material: Fused Silica, Borosilicate¹

  • Fiber: Any common SM or PM fiber

  • Channel: 1, 2, 4, 8, or 16 fibers¹

  • Fiber Pitch/Spacings: 127µm, 250µm, and 254µm standard¹

  • Standard Size: V-Groove thickness: 1.5mm; Lid thickness: 200µm (polished through into fiber cladding at the tip)

  • Near-Vertical Fiber Angle: 8° or 4° from top surface normal¹

  • Probe Tip Angle: Typically around 50°, depending on the desired geometry, near-vertical angle, and use of index-matching fluid

  • Reflection Type: Metallized mirror or TIR

  • Connectors: FC/PC, FC/APC, MT (others available)

¹Custom specifications available

 

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