silicon photonic optical packaging
SERVICE OVERVIEW
PLC Connections is working directly with organizations, their end-users, and corporations to leverage our extensive experience with passive PICs to develop and promote optical packaging of silicon photonic devices. The goal is to offer a quick turnaround and cost effective packaging service to silicon designers for validation of design, process, and function. PLC Connections offers fiber arrays, fiber probes, and other custom solutions for launching from telecom fiber into silicon waveguides via grating coupler’s standard edge couple, or suspended waveguides with mode converter.
services
Die type: PICs SiP (Silicon Photonics), LiNb03, Silica on silicon and others
Coupling types offered: Edge, Active and Passive, Grating coupler near vertical or in-plane
Die state: bare, mounted to PCB with wire bonds, flip chip backside attach, other
Edge of Die: polished, etched facet w/diced ledge, suspended waveguides (air clad)
Coupling Loss: Dependent on PIC coupler design and fiber MFD matched to die
Bonding: UV adhesive, or air gap for special applications
Fiber types for attachment: UHNA1-7, Lensed, SMF-28, UHNA-PM, Gyro, specialty fibers are welcomed
INFO SHEET DOWNLOADS
END-TO-END SUPPORT
Our clients benefit from our full suite of integrated photonic services and expertise. Let us partner up with you to help move your project forward.