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Silicon Photonics Background

Photonic Integrated Circuits (PICs) are the past, present, and future of fiber-optic communications. The demand for higher bandwidth is driving the technology from passive glass circuits to gallium arsenide, indium phosphide, and silicon. These platforms, compatible with established CMOS processes and foundries, advance the functionality and speed of photonic circuitry.

Several MPW shuttle services like ePIXfab and MOSIS are working to bring silicon photonics to a new competitive level by serving as an organizer and liaison between users, software developers, and CMOS foundries. Through these and other CMOS shuttle organizations, a new generation of optical entrepreneurs and designers has lower cost access to CMOS foundries which will usher in new and enhanced silicon functionality.

Silicon Photonics Services

PLCC is working with directly with these organizations, their end-users, and corporations to leverage our extensive experience with passive PICs to develop and promote optical packaging of silicon photonic devices. The goal is to offer a quick turnaround and cost effective packaging service to silicon designers for validation of design, process, and function. PLCC offers fiber arrays, fiber probes, and other custom solutions for launching from telecom fiber into silicon waveguides via grating coupler or edge couplers.

Components & Specifications

  • Fused silica fiber arrays with selectable fiber type, pitch, polish angle, and fiber count.
  • Mechanical mount for holding fiber arrays is available, see Silicon Photonics PDF download for complete specifications.
  • Full optical packaging service on custom-supplied chip.
  • Precision pitch MFD reducer chip converts PM or SM fibers from 127µm pitch to 20 ± 0.1µm pitch with MFD ~4µm, available for up to 48 channels.
  • In-line coupling element with 127µm pitch, selectable polish angle and fiber count.